A new scientific contribution is now available on International Journal of Microwave and Wireless Technologies!

International Journal of Microwave and Wireless Technologies published a new scientific contribution about our ESA project STEDI (Small user TErminal multiband DIplexers).

Visit STEDI project 

 

The constant growth of high-speed applications among satellite links is foreseen to foster the adoption of multi-band terminals.

For instance, the pairing of Ku and Ka-bands will allow large spectrum for both uplink and downlink which in turn guarantees more high-quality services
for the end users. If such services given by the High-Throughput Satellites and the Direct-to-Home internet access will be available everywhere without physical connections, their mass deployment will likely occur and the design of the mm-wave circuitry has to be compliant with large scale industrialization.

In this scenario, Ku-/Ka-band diplexers for user terminals based on new technologies (such as micromachining on silicon, low-temperature baked ceramics, and thin-film alumina) enable to aim large-scale, low-cost manufacturing of compact RF filters compatible with planar and monolithic circuits.
In the electronic design of radio terminals:

• performance will be maximized because of the low signal-to-noise ratio at the receiving end
• cost and compactness will ensure effective integration and affordable manufacturing.

 

 

THE PAPER

This paper describes some of the outcomes of the “Small user TErminal multi band DIplexer” project where the goal is the validation of novel SMD-compliant planar diplexer.

 

 

KU/KA BAND DIPLEXER BASED ON THIN-FILM TECHNOLOGY FOR SMALL GROUND-SEGMENT USER TERMINALS:

ABSTRACT

The real application scenario concerns an integrated multi-band radio terminal for ground-segment satellite links. The advantageous and novel approach involves the simultaneous use of three different well-established concepts: a microstrip low-pass filter, a substrate integrated waveguide high-pass filter, and the thin-film technology as manufacturing process. The proposed topology applied to a planar alumina-based design guarantees a 15 × 11.1 mm² footprint and the best integration with surface mountable soldering process over standard PCB technology. Achieved performance and resilience to environmental toughness are suitable for consumer-oriented satellite links or man-pack applications. The designed component targets the Ku 10.7–12.75 (RX) and Ka 27.5–30 (TX) GHz bands but the layout can be easily tuned across the spectrum. The described solution has been manufactured and validated. Thermal cycling and mechanical tests have been carried out to prove the high technology readiness level of the proposed device.

You can get access to the FULL VERSION OF PAPER at this link or CONTACT US for more details!

 

Thanks to  RF Microtech team and thanks to our partner SIAE ELECTRONICA for contributions.